Contributing to miniaturization with high-density packaging.
We achieve narrow GAP implementation and miniaturization of high-quality implementation boards.
We support the implementation of small chip components that are essential for miniaturizing substrates, as well as their narrow gap mounting. Our company has contributed to the miniaturization of Sony products by pursuing high-density mounting technology. We provide high-quality support for high-density mounting, such as the implementation of 0402 size components used in mobile devices like smartphones. Additionally, we can also accommodate even smaller 0201 and 03015 size component implementations. 【Features】 ■ Implementation of 0402 size components with narrow gaps ■ Capable of mixed mounting with large components (such as connectors) ■ Also supports the implementation of 0201 and 03015 size components ■ Equipped with solder printing inspection machines, pre-reflow inspection machines, and post-reflow inspection machines to ensure high quality *For more details, please refer to the PDF document or feel free to contact us.
- Company：ソニーグローバルマニュファクチャリング&オペレーションズ
- Price：Other
